05637922 is referenced by 148 patents and cites 10 patents.

A power device component package includes a substrate supporting a drain lead, a source lead, and a gate lead. Each of the leads comprises an electrically conductive material having a thickness sufficient to form a high current contact. A power device component with component pads has an electrically conductive backside supported by and electrically coupled to the drain lead. A dielectric layer overlies at least portions of the component, the source lead, and the gate lead and has a plurality of vias therein aligned with predetermined ones of the component pads and predetermined portions of the source and gate leads. A pattern of electrical conductors extends through selected ones of the vias, with a first portion of the pattern coupling selected ones of the component pads to the source lead and a second portion of the pattern coupling at least one other of the component pads to the gate lead.

Title
Wireless radio frequency power semiconductor devices using high density interconnect
Application Number
8/192533
Publication Number
5637922
Application Date
February 7, 1994
Publication Date
June 10, 1997
Inventor
James F Burgess
Schenectady
NY, US
Otward M Mueller
Ballston Lake
NY, US
Raymond A Fillion
Schenectady
NY, US
Agent
Marvin Snyder
Ann M Agosti
Assignee
General Electric Company
NY, US
IPC
H01L 23/053
H01L 23/34
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