05635846 is referenced by 218 patents and cites 44 patents.

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Title
Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer
Application Number
8/55485
Publication Number
5635846
Application Date
April 30, 1993
Publication Date
June 3, 1997
Inventor
George F Walker
New York
NY, US
Da Yuan Shih
Poughkeepsie
NY, US
Maurice H Norcott
Valley Cottage
NY, US
Paul A Lauro
Nanuet
NY, US
Keith E Fogel
Bardonia
NY, US
Brian S Beaman
Hyde Park
NY, US
Agent
Daniel P Morris
Assignee
International Business Machines Corporation
NY, US
IPC
G01R 31/02
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