05629838 is referenced by 161 patents.

A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/repairability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.

Title
Apparatus for non-conductively interconnecting integrated circuits using half capacitors
Application Number
82328
Publication Number
5629838
Application Date
June 24, 1994
Publication Date
May 13, 1997
Inventor
David B Salzman
Washington
DC, US
Thomas F Knight
Belmont
MA, US
Agent
Pennie & Edmonds
Assignee
Polychip
MD, US
IPC
H05K 1/16
H05K 7/02
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