05625222 is referenced by 465 patents and cites 7 patents.

A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.

Title
Semiconductor device in a resin package housed in a frame having high thermal conductivity
Application Number
8/281098
Publication Number
5625222
Application Date
July 27, 1994
Publication Date
April 29, 1997
Inventor
Kazuto Tsuji
Kawasaki
JP
Yoshiyuki Yoneda
Kawasaki
JP
Agent
Armstrong Westerman Hattori McLeland & Naughton
Assignee
Fujitsu
JP
IPC
H01L 23/34
H01L 23/28
H01L 23/10
H01L 23/08
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