05618400 is referenced by 1 patents and cites 6 patents.

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.

Title
Electroplating process
Application Number
8/531171
Publication Number
5618400
Application Date
September 19, 1995
Publication Date
April 8, 1997
Inventor
Mark J Kapeckas
Worcester
MA, US
Edward C Couble
Brockton
MA, US
Carl J Colangelo
New Bedford
MA, US
Jeffrey P Burress
Milford
MA, US
Steven M Florio
Hopkinton
MA, US
Agent
Robert L Goldberg
Assignee
Shipley Company L L C
MA, US
IPC
C23C 28/00
C25D 21/18
C25D 21/16
C25D 21/06
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