05611140 is referenced by 102 patents and cites 27 patents.

A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.

Title
Method of forming electrically conductive polymer interconnects on electrical substrates
Application Number
452191
Publication Number
5611140
Application Date
February 10, 1995
Publication Date
March 18, 1997
Inventor
Richard H Estes
Hollis
NH, US
Frank W Kulesza
Winchester
MA, US
Agent
Fish & Richardson P C
Assignee
Epoxy Technology
MA, US
IPC
H05K 3/30
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