05604376 is referenced by 228 patents and cites 7 patents.

Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.

Title
Paddleless molded plastic semiconductor chip package
Application Number
8/269294
Publication Number
5604376
Application Date
June 30, 1994
Publication Date
February 18, 1997
Inventor
Yezdi N Dordi
Cambridge
MA, US
John S Fitch
Newark
CA, US
William R Hamburgen
Palo Alto
CA, US
Agent
Arthur W Fisher
Denis G Maloney
David A Dagg
Assignee
Digital Equipment Corporation
MA, US
IPC
H01L 23/495
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