05578869 is referenced by 156 patents and cites 42 patents.

There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

Title
Components for housing an integrated circuit device
Application Number
8/413149
Publication Number
5578869
Application Date
March 29, 1994
Publication Date
November 26, 1996
Inventor
Arvind Parthasarathi
North Branford
CT, US
Dawit Solomon
Manteca
CA, US
George A Brathwaite
Hayward
CA, US
Deepak Mahulikar
Madison
CT, US
Paul R Hoffman
Modesto
CA, US
Agent
Gregory S Rosenblatt
Assignee
Olin Corporation
CA, US
IPC
H01L 23/04
H01L 23/48
H01L 23/34
H01L 23/52
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