05545923 is referenced by 166 patents and cites 4 patents.

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed on one surface of a printed wring board and is divided into electrically insulated conductive segments. Each of the conductive segments is connected to an external connection, and includes one or more interconnects that can be directly connected to a semiconductor die. The conductive segments are surrounded by an array of bond fingers which serve to connect the semiconductor die to further external connections, such as signal connections. The present invention is especially advantageous in the fabrication of pin grid array (PGA) and ball grid array (BGA) type integrated circuit packages.

Title
Semiconductor device assembly with minimized bond finger connections
Application Number
142251
Publication Number
5545923
Application Date
February 28, 1995
Publication Date
August 13, 1996
Inventor
Ivor Barber
San Jose
CA, US
Agent
Katz & Cotton
Assignee
LSI Logic Corporation
CA, US
IPC
H01L 23/04
H01L 23/52
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