05541525 is referenced by 147 patents and cites 22 patents.

A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect to the base; and a force distribution mechanism for biasing the die and interconnect together. The interconnect includes a substrate having raised contact members adapted to penetrate bond pads, or tests pads, on the die to form an electrical connection. Conductive traces are formed on the substrate in electrical communication with the raised contact members and connect to external connectors formed on the base. The interconnect is adapted for testing a particular type of die but is interchangeable with other interconnects to permit testing of different types of dice using a universal carrier.

Title
Carrier for testing an unpackaged semiconductor die
Application Number
709858
Publication Number
5541525
Application Date
November 14, 1994
Publication Date
July 30, 1996
Inventor
David R Hembree
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Alan G Wood
Boise
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
G01R 1/073
G01R 31/02
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