05539064 is referenced by 16 patents and cites 12 patents.

A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.

Title
Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board
Application Number
8/526983
Publication Number
5539064
Application Date
September 12, 1995
Publication Date
July 23, 1996
Inventor
Toshikazu Oda
Kyoto
JP
Toshiaki Nishimura
Kyoto
JP
Satoshi Miyayama
Kyoto
JP
Soichi Hashimoto
Kyoto
JP
Agent
Banner & Allegretti
Assignee
Goo Chemical
JP
IPC
G03C 1/725
C08J 3/28
C08F 283/00
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