05538821 is referenced by 10 patents and cites 17 patents.

The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom.

In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.

Title
Resist ink composition and cured article prepared therefrom
Application Number
8/240023
Publication Number
5538821
Application Date
May 9, 1994
Publication Date
July 23, 1996
Inventor
Kazunori Sasahara
Shimonoseki
JP
Tetsuo Ohkubo
Ube
JP
Minoru Yokoshima
Toride
JP
Kazuhiro Yoshida
Ogawa-machi
JP
Shigeru Komori
Konosu
JP
Masahisa Kakinuma
Menuma-machi
JP
Agent
Nields & Lemack
Assignee
Taiyo Ink Manufacturing
JP
Nippon Kayaku Kabushiki Kaisha
JP
IPC
G03C 3/00
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