05534784 is referenced by 112 patents and cites 9 patents.

A method for probing a semiconductor wafer utilizes an array probe assembly (60) which includes a production package substrate (64). Substrate (64) is used to transform a configuration of conductive pads (74) on a probe card (62) into a configuration which matches that of conductive bumps (54) on a semiconductor die (52). Array probe assembly (60) may also include an array probe head (68) having probe wires (84) for coupling conductive pads (80) on substrate (64) with conductive bumps (54) on die (52). After probing the die, the die are assembled into a final packaged semiconductor device (110) which includes a substrate (90) which is nearly identical to the substrate used in the array probe assembly. Use of a production package substrate in the array probe assembly reduces the cost of the array probe assembly, and results in more accurate testing since the substrate in the array probe assembly will emulate the performance of the die in the final packaged device.

Title
Method for probing a semiconductor wafer
Application Number
8/236847
Publication Number
5534784
Application Date
May 2, 1994
Publication Date
July 9, 1996
Inventor
James F Wenzel
Austin
TX, US
Thomas F Lum
Austin
TX, US
Agent
Patricia S Goddard
Assignee
Motorola
IL, US
IPC
G01R 31/02
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