05534465 is referenced by 146 patents and cites 10 patents.

In accordance with the invention, a multichip circuit is fabricated by providing an active semiconductor substrate comprising a set of isolated components including active components such as transistors, forming on a surface of the substrate a plurality of paths incorporating components from the substrate for interconnecting a plurality integrated circuit devices, and mounting the ICs on the surface in contact with their respectively appropriate paths. The preferred active substrate is similar in structure to a silicon integrated circuit except that the circuit components are interconnected only by the paths interconnecting the ICs. Advantageously the ICs are surface mounted on the substrate.

Title
Method for making multichip circuits using active semiconductor substrates
Application Number
8/370902
Publication Number
5534465
Application Date
January 10, 1995
Publication Date
July 9, 1996
Inventor
King L Tai
Berkeley Heights
NJ, US
Robert C Frye
Piscataway
NJ, US
Agent
Glen E Books
Assignee
AT&T
NJ, US
IPC
H01L 21/60
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