05527741 is referenced by 187 patents and cites 13 patents.

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.

Title
Fabrication and structures of circuit modules with flexible interconnect layers
Application Number
8/321346
Publication Number
5527741
Application Date
October 11, 1994
Publication Date
June 18, 1996
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
Ronald F Kolc
Cherry Hill
NJ, US
Bernard Gorowitz
Clifton Park
NY, US
Raymond A Fillion
Niskayuna
NY, US
Herbert S Cole
Burnt Hills
NY, US
Agent
Geoffrey H Krauss
Assignee
Martin Marietta Corporation
MD, US
IPC
H01L 21/60
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