05519332 is referenced by 154 patents and cites 6 patents.

A carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.

Title
Carrier for testing an unpackaged semiconductor die
Application Number
709858
Publication Number
5519332
Application Date
March 1, 1995
Publication Date
May 21, 1996
Inventor
David R Hembree
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Alan G Wood
Boise
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
G01R 31/02
G01R 1/073
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