05514907 is referenced by 122 patents and cites 44 patents.

A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.

Title
Apparatus for stacking semiconductor chips
Application Number
8/408552
Publication Number
5514907
Application Date
March 21, 1995
Publication Date
May 7, 1996
Inventor
Mark Moshayedi
Orange
CA, US
Agent
Knobbe Martens Olson & Bear
Assignee
Simple Technology Incorporated
CA, US
IPC
H05K 7/00
H01L 23/04
H01L 23/02
H01L 23/34
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