05510298 is referenced by 237 patents and cites 14 patents.

An integrated circuit interconnect structure is provided, along with a method of forming the integrated circuit interconnect structure. A semiconductor material layer has an elongate trench formed therein. A conducting region is disposed in the trench. An insulator region overlies the conducting region. One or more contact regions are disposed through the insulator region to contact the conducting region.

Title
Method of interconnect in an integrated circuit
Application Number
758653
Publication Number
5510298
Application Date
September 12, 1994
Publication Date
April 23, 1996
Inventor
Donald J Redwine
Houston
TX, US
Agent
Leo Heiting
Rich Donaldson
William W Holloway
Assignee
Texas Instruments Incorporated
TX, US
IPC
H01L 21/48
H01L 21/44
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