05506755 is referenced by 50 patents and cites 5 patents.

A multi-layer wiring substrate includes an aluminum nitride ceramic substrate, a multi-layer wiring part having an electric insulating layer of an organic polymer, a die pad for mounting thereon an electronic part, and a thermal via of a column shape for effectively dissipating heat generated in the mounted electric part. The multi-layer wiring part is integrally formed on the ceramic substrate. The die pad is provided on a surface of the multi-layer wiring part. One end of the thermal via connects to the die pad, while the other end of the thermal via passes through the multi-layer wiring part and extends at least to the ceramic substrate. The thermal via is electrically insulated from the multi-layer wiring part. In the second multi-layer wiring substrate, at least one of end portions of the above thermal via is wider than a section of the other portion of the thermal via, resulting in further improvement of the heat dissipating property.

Title
Multi-layer substrate
Application Number
29656
Publication Number
5506755
Application Date
August 18, 1994
Publication Date
April 9, 1996
Inventor
Katsumi Hisano
Yokohama
JP
Hideo Iwasaki
Kawasaki
JP
Tomiya Sasaki
Yokohama
JP
Kazuhiro Matsumoto
Yokohama
JP
Takeshi Miyagi
Fujisawa
JP
Agent
Finnegan Henderson Farabow Garrett & Dunner
Assignee
Kabushiki Kaisha Toshiba
JP
IPC
H05K 7/20
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