05497033 is referenced by 311 patents and cites 20 patents.

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.

Title
Embedded substrate for integrated circuit modules
Application Number
14481
Publication Number
5497033
Application Date
June 20, 1994
Publication Date
March 5, 1996
Inventor
Wolfgang Daum
Schenectady
NY, US
Eric J Wildi
Niskayuna
NY, US
Herbert S Cole
Burnt Hills
NY, US
Michael Gdula
Knox
NY, US
Robert J Woinarowski
Ballston Lake
NY, US
Raymond A Fillion
Niskayuna
NY, US
Agent
Geoffrey H Krauss
Brian J Rees
Assignee
Martin Marietta Corporation
MD, US
IPC
H05K 7/10
H01L 23/14
H01L 23/29
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