05481133 is referenced by 350 patents and cites 5 patents.

A multichip array package for IC devices with a master semiconductor device supporting and electrically interconnected with a stacked array of subordinate devices. The interconnection structure has a peripheral row of contact pads on the master device. The subordinate devices each have a peripheral row of contact pads that corresponds to the peripheral row on the master device. Openings are provided through the contact pads on the subordinate devices that are in registry. The holes are filled with metal which interconnects the subordinate devices with the master device.

Title
Three-dimensional multichip package
Application Number
214990
Publication Number
5481133
Application Date
December 29, 1994
Publication Date
January 2, 1996
Inventor
Chen Chung Hsu
Taichung
TW
Agent
Wolmar Stoffel
George O Saile
Assignee
United Microelectronics Corporation
TW
IPC
H01L 29/40
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