05474958 is referenced by 321 patents and cites 22 patents.

A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder (60) with a vacuum (62) for the wire bonding process. Wire bonds (26) electrically connect the die to the conductors. The wire bonded die is then placed inside a mold cavity (64), and a resin encapsulated is transferred into the cavity under elevated temperature and pressure to form package body (70) around the die, the wire bonds and a portion of the conductors. Before the package body is formed, the die is supported solely by the the rigidity of the wire bonds since there is no die supporting surface connected to the conductors.

Title
Method for making semiconductor device having no die supporting surface
Application Number
8/55863
Publication Number
5474958
Application Date
May 4, 1993
Publication Date
December 12, 1995
Inventor
Les Postlethwait
Lexington
TX, US
Twila J Reeves
Austin
TX, US
John R Pastore
Leander
TX, US
Victor K Nomi
Round Rock
TX, US
Frank Djennas
Austin
TX, US
Agent
Minh Hien N Clark
Assignee
Motorola
IL, US
IPC
H01L 21/56
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