05474957 is referenced by 196 patents and cites 8 patents.

Conductive leads are connected at inner ends thereof to electrodes of a semiconductor chip through a tape automated bonding process, and bumps are formed on the other ends of the conductive leads so as to economically and reliably mount the semiconductor chip on a circuit board through a concurrent reflow.

Title
Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
Application Number
8/430590
Publication Number
5474957
Application Date
April 28, 1995
Publication Date
December 12, 1995
Inventor
Michitaka Urushima
Tokyo
JP
Assignee
NEC Corporation
JP
IPC
H01L 21/60
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