05469324 is referenced by 113 patents and cites 5 patents.

A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.

Title
Integrated decoupling capacitive core for a printed circuit board and method of making same
Application Number
8/319651
Publication Number
5469324
Application Date
October 7, 1994
Publication Date
November 21, 1995
Inventor
Stanley R Szerlip
Longmont
CO, US
Floyd G Paurus
Boulder
CO, US
Watson R Henderson
Broomfield
CO, US
Agent
Sterne Kessler Goldstein & Fox
Assignee
Storage Technology Corporation
CO, US
IPC
H01G 4/018
View Original Source