05455459 is referenced by 65 patents and cites 12 patents.

A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion of the module underlying a ply in the electrical interconnection structure is substantially unimpairable by a process for removing that ply.

Title
Reconstructable interconnect structure for electronic circuits
Application Number
858452
Publication Number
5455459
Application Date
June 9, 1994
Publication Date
October 3, 1995
Inventor
Herbert S Cole Jr
Burnt Hills
NY, US
Raymond A Fillion
Schenectady
NY, US
Agent
Geoffrey H Krauss
Brian J Rees
Assignee
Martin Marietta Corporation
MD, US
IPC
H01L 23/02
View Original Source