05452182 is referenced by 84 patents and cites 51 patents.

A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.

Title
Flexible high density interconnect structure and flexibly interconnected system
Application Number
504769
Publication Number
5452182
Application Date
April 7, 1992
Publication Date
September 19, 1995
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
William P Kornrumpf
Albany
NY, US
Charles W Eichelberger
Schenectady
NY, US
Agent
Geoffrey H Krauss
Marvin Snyder
Assignee
Martin Marietta Corporation
MD, US
IPC
H05K 1/18
H05K 1/14
H05K 1/11
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