05448014 is referenced by 123 patents and cites 12 patents.

The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of electrically testing each device is significantly reduced over the prior art by making use of mass simultaneous sealing and electrical connection at the wafer level, and by using substrates with hermetically sealed and electrically conductive via holes. Further, cost reduction is effected by making use of final electrical testing with wafer probe test techniques before dicing.

Title
Mass simultaneous sealing and electrical connection of electronic devices
Application Number
8/9530
Publication Number
5448014
Application Date
January 27, 1993
Publication Date
September 5, 1995
Inventor
Steven S Chan
Alhambra
CA, US
James C Lau
Torrance
CA, US
Alvin M Kong
Los Angeles
CA, US
Assignee
TRW
CA, US
IPC
H05K 5/06
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