05435733 is referenced by 21 patents and cites 14 patents.

A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Title
Connector assembly for microelectronic multi-chip-module
Application Number
8/152342
Publication Number
5435733
Application Date
November 12, 1993
Publication Date
July 25, 1995
Inventor
Haim Feigenbaum
Irvine
CA, US
Bao Q Le
Santa Ana
CA, US
Alan L Kovacs
Long Beach
CA, US
Christopher M Schreiber
Lake Elsinore
CA, US
Gerald P Chernicky
Fountain Valley
CA, US
Agent
W K Denson Low
Terje Gudmestad
Elizabeth E Leitereg
Assignee
Hughes Aircraft Company
CA, US
IPC
H01L 21/60
View Original Source