05432729 is referenced by 283 patents and cites 5 patents.

An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, providing electrical, mechanical and thermal interconnection. The active substrate is a layer containing substantial amounts of integrated circuitry, which interfaces, on one hand, with the integrated circuitry in the stacked chips, and, on the other hand, with the external computer bus system. Some of the high priority circuitry which may be included in the substrate is used for control, fault-tolerance, buffering, and data management.

Title
Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack
Application Number
52475
Publication Number
5432729
Application Date
June 8, 1994
Publication Date
July 11, 1995
Inventor
Raphael R Some
Irvine
CA, US
John C Carson
Corona del Mar
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H01L 27/00
View Original Source