05411076 is referenced by 46 patents and cites 4 patents.

A treating chamber includes a cooling plate assembly for supporting and cooling a substrate and an auxiliary cooling plate disposed on or adjacent a ceiling of the treating chamber. The auxiliary cooling plate reduces an atmospheric temperature in a space above the substrate supported on the cooling plate assembly to a target temperature to which the substrate is to be cooled by the cooling plate assembly. Consequently, the substrate having undergone a high temperature treatment is cooled quickly to the target temperature, and improved uniformity of temperature distribution is secured over a substrate surface after the cooling step.

Title
Substrate cooling device and substrate heat-treating apparatus
Application Number
8/192563
Publication Number
5411076
Application Date
February 7, 1994
Publication Date
May 2, 1995
Inventor
Yasuhiro Mizohata
Kyoto
JP
Minobu Matsunaga
Kyoto
JP
Agent
Ostrolenk Faber Gerb & Soffen
Assignee
Dainippon Screen Mfg Corp of Japan
JP
IPC
F28F 7/00
View Original Source