05399898 is referenced by 337 patents and cites 8 patents.

Multi-chip, multi-tier semiconductor arrangements based upon single and double-sided flip-chips are described. The double-sided flip chips provide raised bump contact means on both major surfaces of a die and provided connections to internal signals within the die, feed through connections between contacts on opposite sides of the die, and jumpered connections between contacts on the same side of the die. Various multi-chip configurations are described. Certain of these flip-chip configuration dramatically increase the ratio of I/O area (periphery) to footprint area, permitting larger numbers of I/O points within a given assembly footprint than would otherwise be possible in a single die configuration.

Title
Multi-chip semiconductor arrangements using flip chip dies
Application Number
935449
Publication Number
5399898
Application Date
November 12, 1992
Publication Date
March 21, 1995
Inventor
Michael D Rostoker
San Jose
CA, US
Agent
Hongiman Miller Schwartz and Cohn
Assignee
LSI Logic Corporation
CA, US
IPC
H01L 23/54
H01L 23/52
H05K 1/14
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