05397917 is referenced by 127 patents and cites 11 patents.

A package (10, 37, 39) capable of spreading heat from a semiconductor die (25). The package (10, 37) includes a heat spreader (11) having a thickness of approximately 0.2 millimeters and a plurality of heat spreader clearance holes (16). The heat spreader (11) is coated with an adhesive material (17) which fills the plurality of heat spreader clearance holes (16). A substrate layer (18) is formed on the adhesive material (17). The substrate layer (18) has conductive traces (20, 24) and conductive pads (21) disposed thereon. A cavity (23) may be present in the package (10, 37, 39) which exposes a portion of the heat spreader (11) and is adapted to receive the semiconductor die (25). The cavity (23) is covered by a cavity sealing means (30, 38).

Title
Semiconductor package capable of spreading heat
Application Number
8/51954
Publication Number
5397917
Application Date
April 26, 1993
Publication Date
March 14, 1995
Inventor
John Baird
Scottsdale
AZ, US
Chi Taou Tsai
Chandler
AZ, US
Denise M Ommen
Phoenix
AZ, US
Agent
Rennie William Dover
Assignee
Motorola
IL, US
IPC
H01L 23/12
H01L 23/02
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