05388944 is referenced by 52 patents and cites 14 patents.

A wafer loading and unloading chamber is provided at the bottom of a reaction tube of a heat treatment section, a robot chamber and cassette chamber are coupled via gate valves to the wafer loading and unloading chamber, the robot chamber comprises a first load lock chamber while the wafer loading and unloading chamber comprises a second load lock chamber. These first and second load lock chambers are mutually connected by a pressure balancing gas conduit via pressure balancing valves. During heat treatment of the target objects, the wafer loading and unloading chamber and robot chamber are first set to inert gas atmospheres, then the pressure balancing gas conduit valves are opened to balance the pressures of the robot and cassette chambers. Gate valves between these chambers are then opened, and the cassette is conveyed via the robot chamber to a wafer boat in the wafer loading and unloading chamber. By this process gas flow between the two chambers when the gate valves are opened is suppressed to allow minimizing the production of particles.

Title
Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus
Application Number
8/13366
Publication Number
5388944
Application Date
February 4, 1993
Publication Date
February 14, 1995
Inventor
Tadataka Noguchi
Kitakyushu
JP
Takeo Suzuki
Iruma
JP
Eiichiro Takanabe
Sagamihara
JP
Agent
Beveridge DeGrandi Weilacher & Young
Assignee
Tokyo Electron Tohoku Kabushiki Kaisha
JP
IPC
B65G 49/07
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