05386625 is referenced by 5 patents and cites 23 patents.

A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the leads are deformed by some object by accident, it is not necessary to correct the shape of the leads since such end portions will be eventually cut off and discarded in the event of packaging of the IC.

Title
Tab type IC assembling method and an IC assembled thereby
Application Number
18517
Publication Number
5386625
Application Date
March 9, 1994
Publication Date
February 7, 1995
Inventor
Kenji Tsukamoto
Tokyo
JP
Agent
Sughrue Mion Zinn Macpeak & Seas
Assignee
NEC Corporation
JP
IPC
H05K 3/30
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