05386341 is referenced by 147 patents and cites 7 patents.

Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.

Title
Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
Application Number
8/143594
Publication Number
5386341
Application Date
November 1, 1993
Publication Date
January 31, 1995
Inventor
Mark Fulcher
Hanover Park
IL, US
Tomasz L Klosowiak
Glenview
IL, US
David W Currier
Algonquin
IL, US
William L Olson
Lindenhurst
IL, US
Agent
Phillip H Melamed
Assignee
Motorola
IL, US
IPC
H05K 1/00
H05K 7/20
View Original Source