05371047 is referenced by 53 patents and cites 18 patents.

An integrated circuit having organic dielectric between interconnection layers eliminates damage caused by vapors outgassing from the organic dielectric by the use of a two-component organic layer having a breathable etch resistant organic layer above the main organic dielectric layer, both of the organic layers remaining in the final circuit. The etch resistant layer is resistant to the etchant used to pattern the layer of interconnect above the organic dielectric.

Title
Chip interconnection having a breathable etch stop layer
Application Number
7/968789
Publication Number
5371047
Application Date
October 30, 1992
Publication Date
December 6, 1994
Inventor
Kris V Srikrishnan
Wappingers Falls
NY, US
Stephen E Greco
LaGrangeville
NY, US
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/90
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