05355283 is referenced by 330 patents and cites 5 patents.

A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.

Title
Ball grid array with via interconnection
Application Number
8/47721
Publication Number
5355283
Application Date
April 14, 1993
Publication Date
October 11, 1994
Inventor
Tadashi Hirakawa
Osaka
JP
Robert C Marrs
Scottsdale
AZ, US
Agent
Skjerven Morrill MacPherson Franklin & Friel
Assignee
Teijin
JP
Amkor Electronics
PA, US
IPC
H01L 23/28
H05K 7/02
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