05353498 is referenced by 693 patents and cites 17 patents.

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.

Title
Method for fabricating an integrated circuit module
Application Number
14481
Publication Number
5353498
Application Date
July 9, 1993
Publication Date
October 11, 1994
Inventor
Wolfgang Daum
Schenectady
NY, US
Eric J Wildi
Niskayuna
NY, US
Herbert S Cole
Burnt Hills
NY, US
Michael Gdula
Knox
NY, US
Robert J Wojnarowski
Ballston Lake
NY, US
Raymond A Fillion
Niskayuna
NY, US
Agent
Geoffrey H Krauss
Assignee
General Electric Company
NY, US
IPC
H05K 3/34
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