Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip United States Patent 05347428

05347428 is referenced by 289 patents and cites 3 patents.

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Title
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
Application Number
7/985837
Publication Number
5347428
Application Date
December 3, 1992
Publication Date
September 13, 1994
Inventor
Stuart N Shanken
Irvine
CA, US
Ronald J Indin
Huntington Beach
CA, US
John C Carson
Corona del Mar
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H05K 7/02
View Original Source

Citations: 289 (view full list)

  1. David E Ludwig, Christ H Saunders, Raphael R Some, John J Stuart: Stack of IC chips in lieu of single IC chip. Irvine Sensors Corporation, Thomas J Plante, December 3, 1996: US05581498 (301 worldwide citation)
  2. Kate E Fey, Charles L Byers, Lee J Mandell: Space-saving packaging of electronic circuits. Alfred E Mann Foundation for Scientific Research, Gary D Schnittgrund, July 4, 2006: US07071546 (257 worldwide citation)
  3. Claude L Bertin, Wayne J Howell, Erik L Hedberg, Howard K Kalter, Gordon A Kelley Jr: Integrated multichip memory module structure. International Business Machines Corporation, Heslin & Rothenberg, March 26, 1996: US05502667 (161 worldwide citation)
  4. Claude L Bertin, Wayne J Howell, Erik L Hedberg, Howard L Kalter, Gordon A Kelley Jr: Integrated memory cube structure. International Business Machines Corporation, Heslin & Rothenberg P C, October 1, 1996: US05561622 (158 worldwide citation)
  5. Claude Louis Bertin, Wayne John Howell, Erik Leigh Hedberg, Howard Leo Kalter, Gordon Arthur Kelley Jr: Integrated mulitchip memory module, structure and fabrication. International Business Machines Corporation, Heslin & Rothenberg P C, December 30, 1997: US05702984 (124 worldwide citation)
  6. Claude L Bertin, Wayne J Howell, Erik L Hedberg, Howard L Kalter, Gordon A Kelley Jr: Integrated memory cube, structure and fabrication. International Business Machines Corporation, Heslin & Rothenberg P C, October 8, 1996: US05563086 (117 worldwide citation)
  7. David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)
  8. Suresh N Rajan: Methods and apparatus of stacking DRAMs. MetaRAM, Zilka Kotab PC, May 27, 2008: US07379316 (108 worldwide citation)
  9. Suresh Natarajan Rajan, Keith R Schakel, Michael John Sebastian Smith, David T Wang, Frederick Daniel Weber: Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit. MetaRAM, Zilka Kotab PC, June 10, 2008: US07386656 (87 worldwide citation)
  10. Paul Goodwin: High capacity thin module system and method. Staktek Group, Fish & Richardson P C, January 29, 2008: US07324352 (84 worldwide citation)

References: 3

  1. Tiong C Go: High-density electronic modules--process and product. Irvine Sensors Corporation, Thomas J Plante, November 10, 1987: US04706166 (252 worldwide citation)
  2. Tiong C Go deceased, Joseph A Minahan, Stuart N Shanken: Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting. Irvine Sensors Corporation, Thomas J Plante, April 14, 1992: US05104820 (250 worldwide citation)
  3. Tiong C Go: High-density electronic modules - process and product. Irvine Sensors Corporation, Thomas J Plante, January 8, 1991: US04983533 (218 worldwide citation)