05347428 is referenced by 289 patents and cites 3 patents.

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Title
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
Application Number
7/985837
Publication Number
5347428
Application Date
December 3, 1992
Publication Date
September 13, 1994
Inventor
Stuart N Shanken
Irvine
CA, US
Ronald J Indin
Huntington Beach
CA, US
John C Carson
Corona del Mar
CA, US
Agent
Thomas J Plante
Assignee
Irvine Sensors Corporation
CA, US
IPC
H05K 7/02
View Original Source