05345366 is referenced by 28 patents and cites 2 patents.

A substrate to substrate interconnect and standoff assembly (10) comprises an electronic coupling (39) between the bottom of a first substrate (14) and the bottom of a second substrate (12), an electronic coupling (24) of the top of the first substrate to the bottom of the second substrate, a stand-off (20) between the first substrate and the second substrate, and a mechanical coupling (16) between the first substrate to the second substrate.

Title
Substrate to substrate standoff assembly
Application Number
8/64479
Publication Number
5345366
Application Date
May 21, 1993
Publication Date
September 6, 1994
Inventor
Kai L Tong
Singapore
SG
Chiou C You
Singapore
SG
Chee F Cheng
Singapore
SG
Agent
Pablo Meles
Assignee
Motorola
IL, US
IPC
H01R 23/68
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