05345205 is referenced by 75 patents and cites 13 patents.

A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.

Title
Compact high density interconnected microwave system
Application Number
7/504753
Publication Number
5345205
Application Date
April 5, 1990
Publication Date
September 6, 1994
Inventor
William P Kornrumpf
Albany
NY, US
Agent
Geoffrey Krauss
Robert Ochis
Assignee
General Electric Company
NY, US
IPC
H05K 1/00
H01P 3/08
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