05326428 is referenced by 167 patents and cites 3 patents.

A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

Title
Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
Application Number
7163940
Publication Number
5326428
Application Date
September 3, 1993
Publication Date
July 5, 1994
Inventor
Gurtej S Sandhu
Boise
ID, US
Malcolm Grief
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Wells St John Roberts Gregory & Matkin
Assignee
Micron Semiconductor
ID, US
IPC
C03C 25/06
C03C 15/00
B44C 1/22
H01L 21/306
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