05317656 is referenced by 67 patents and cites 7 patents.

A fiber-optic network for communicating non-invasive, real-time, in-situ semiconductor wafer radiance and emissivity measurements. The fiber-optic network includes a plurality of optical fibers, a plurality of fiber-optic bundles, and a chopper multiplexer. The fiber-optic bundle provides for the simultaneous transmission and receipt of coherent infrared light energy and radiant heat energy from a semiconductor wafer within a fabrication reactor. The fiber-optic bundles are designed to be sufficiently small to fit within hollow light pipe in a lamp module that directs optical heating energy to the wafer. This substantially eliminates measurement error that the lamp module generates in known measurement devices. Use of optical fibers for transmitting and receiving laser energy and wafer radiance permits precision placement of the fiber-optic bundles to measure multiple temperatures on the semiconductor wafer surface.

Title
Fiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometry
Application Number
702798
Publication Number
5317656
Application Date
February 11, 1993
Publication Date
May 31, 1994
Inventor
Habib N Najm
Dallas
TX, US
Mehrdad M Moslehi
Dallas
TX, US
Agent
Richard L Donaldson
Wade James Brady
Assignee
Texas Instruments Incorporated
TX, US
IPC
G02B 6/02
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