05315486 is referenced by 90 patents and cites 27 patents.

A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.

Title
Hermetically packaged HDI electronic system
Application Number
807325
Publication Number
5315486
Application Date
June 7, 1993
Publication Date
May 24, 1994
Inventor
Edward S Bernard
Manlius
NY, US
William P Kornrumpf
Albany
NY, US
Raymond A Fillion
Niskayuna
NY, US
Agent
Geoffrey H Krauss
Assignee
General Electric Company
NY, US
IPC
H05K 1/16
H01L 23/10
H01L 23/055
H01L 23/053
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