05311058 is referenced by 11 patents and cites 3 patents.

A power distribution system for distributing power to an IC is formed by attaching a grid having at least one power bus and one ground bus to the top surface of the IC die. The grid is adapted to be electrically coupled with power and ground pins in the IC's package The grid has an insulative layer on its bottom surface to electrically isolate the grid's bottom surface from the IC. The grid is adapted to cover substantially the entire top surface of the IC and to be electrically coupled directly from the top surface of the grid to terminal or connection points on the top surface of the IC. The connection points can be distributed throughout the IC to reduce the area of metallization in the IC and the path length the current from the power busses must traverse.

Title
Integrated circuit power distribution system
Application Number
7/800294
Publication Number
5311058
Application Date
November 29, 1991
Publication Date
May 10, 1994
Inventor
Robert Smolley
Porteuguese Bend
CA, US
Agent
Ronald L Taylor
Assignee
TRW
CA, US
IPC
H01L 23/60
H01L 23/52
H01L 23/44
H01L 23/48
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