05304513 is referenced by 47 patents and cites 17 patents.

A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Title
Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
Application Number
218273
Publication Number
5304513
Application Date
May 13, 1993
Publication Date
April 19, 1994
Inventor
Renee Lucia Barak
Unterhaching
DE
Yahya Haghiri Tehrani
Munchen
DE
Agent
Bacon & Thomas
Assignee
GAO Gesellschaft fur Automation und Organisation mbH
DE
IPC
H01L 21/60
H01L 21/56
H01L 21/58
H01L 21/52
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