05291066 is referenced by 56 patents and cites 13 patents.

A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).

Title
Moisture-proof electrical circuit high density interconnect module and method for making same
Application Number
7/791690
Publication Number
5291066
Application Date
November 14, 1991
Publication Date
March 1, 1994
Inventor
Raymond A Fillion
Schenectady
NY, US
Eugene L Bartels
Elnora
NY, US
Herbert S Cole
Burnt Hills
NY, US
Constantine A Neugebauer
Schenectady
NY, US
Agent
Howard A Skaist
Geoffrey H Krauss
Assignee
General Electric Company
NY, US
IPC
H01L 23/02
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