05286679 is referenced by 163 patents and cites 10 patents.

An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies, as well as the streets between the dies, are free of adhesive material The adhesive layer may be deposited and patterned using a hot or cold screen printing process, by depositing and photopatterning a photosensitive adhesive, or using a resist etch back method. During a packaging process for attaching a die to a leadframe, the adhesive layer is heated and the lead fingers of the leadframe are placed in contact with the die under pressure. In an alternate embodiment of the invention, the lead fingers, rather than a side of the dies, are coated with an adhesive layer.

Title
Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
Application Number
7/33140
Publication Number
5286679
Application Date
March 18, 1993
Publication Date
February 15, 1994
Inventor
Walter Moden
Boise
ID, US
Jerrold L King
Boise
ID, US
Scott Clifford
Boise
ID, US
Ed A Shrock
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 21/60
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