05285352 is referenced by 340 patents and cites 13 patents.

A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surrounded by a metallized area (37, 39), which together may serve as a ground plane in the device. Preferably one or more terminals (26) are attached to the thermal conductor for improved thermal and electrical performance. One method of integrating the thermal conductor in the substrate is to position a metal plug into an opening 30 of the substrate. The plug is then compressed or otherwise plastically deformed to fill the opening and create a substantially planar substrate surface.

Title
Pad array semiconductor device with thermal conductor and process for making the same
Application Number
7/913312
Publication Number
5285352
Application Date
July 15, 1992
Publication Date
February 8, 1994
Inventor
Howard P Wilson
Austin
TX, US
Victor K Nomi
Round Rock
TX, US
John R Pastore
Leander
TX, US
Agent
Patricia S Goddard
Assignee
Motorola
IL, US
IPC
H05K 7/20
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