05281151 is referenced by 132 patents and cites 6 patents.

A semiconductor chip carrier, an electronic module having the semiconductor chip carrier mounted therein, and an electronic device incorporating the electronic module. A semiconductor chip carrier comprises a multi-layer wiring substrate including a multi-layer ceramic board, and a thin film circuit mounted on said multi-layer ceramic board, and a semiconductor chip mounted and connected to the thin film circuit, wherein a low-resistance conductor path is provided on the surface of or in the multi-layer wiring substrate to connect between signal terminals which need to be connected with a low-resistance wire in the semiconductor chip, thereby realizing signal transmission at low resistance between the signal terminals of the semiconductor chip by this conductor path. This arrangement makes it possible to shorten the signal delay time of a semiconductor chip, and achieve higher speed signal processing in modules and electronic equipment in which a thus-improved semiconductor chip is used.

Title
Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module
Application Number
7/902996
Publication Number
5281151
Application Date
June 23, 1992
Publication Date
January 25, 1994
Inventor
Fumiyuki Kobayashi
Sagamihara
JP
Hideho Yamamura
Yokohama
JP
Kenji Takeda
Kamakura
JP
Hideo Arima
Yokohama
JP
Agent
Fay Sharpe Beall Fagan Minnich & McKee
Assignee
Hitachi
JP
IPC
H05K 1/11
View Original Source